Ultraviolet adhesive NOA61 is a transparent, colorless liquid photopolymer that can be cured under ultraviolet light. Because it is a single component and 100% solid, as long as the bond can be irradiated by ultraviolet light, it shows many outstanding advantages when bonding optical components. The use of NOA61 photosensitive adhesives eliminates the need for pre-mixing, drying or thermal curing in other optical adhesives and systems. The curing speed is very fast, and the specific time depends on the application thickness and the energy of receiving the applied ultraviolet light.

 

economical efficiency

 

The curing speed is fast, and the curing can be completed in a few seconds to tens of seconds, which is conducive to the automation of production lines and the improvement of labor productivity.

 

After curing, it can be tested and transported to save space.

 

Room temperature curing can save energy. For example, the energy required to produce 1g photocurable pressure sensitive adhesive is only 1% of the corresponding water-based adhesive and 4% of the solvent-based adhesive. It can be used for materials not suitable for high temperature curing. The energy consumption of UV curing is 90% less than that of thermal curing resin.

 

Curing equipment is simple, only need lamp or conveyor belt, save space;

 

Single component system, no need to mix, easy to use.

 

Compatibility

 

For temperature, solvents and moisture sensitive materials can be used.

 

Control curing, waiting time can be adjusted, curing degree can be adjusted;

 

It can be repeated sizing and curing for many times.

 

Ultraviolet lamps can be easily installed in existing production lines without major changes.

 

Application case

 

1. Optical communication devices (PLC splitter, WDM, AWG and other glass packaging structures are bonded or encapsulated)

 

2. Small speaker device bonding, semiconductor chip packaging, sensor production, hard disk magnetic head bonding, mobile phone components assembly.

 

3. Syringes, catheters, biochips, endoscopes and PVC bonding in medical devices.

 

4. Optical lens bonding (microscopy, infrared, telescope, night vision)

 

5. PCB board (capacitance, inductance, chip), PCB protective coating, coil fixation.

 

6. Scientific research institutions: semiconductor, communication laboratory, medical polymer materials, photocatalysis and other applications.

 

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