Bare chip semiconductor components are manufactured. The product form before packaging usually exists in the form of large wafer or single chip. After packaging, it becomes part of semiconductor components, integrated circuits, or more complex circuits (hybrid circuits).

 

 

 

IC chips are directly bonded to the glass bottom of LCD. Several kinds of flip chip (FCOG) technologies have been developed to bond bare chips to glass. This assembly is accomplished by UV-curable adhesives, which require UV-LED UV-curable adhesives to have excellent adhesion to glass and bare IC chips and low water absorption, especially UV-curable adhesives should have high purity and very low ionic content.

 

Futancy production: UV LED, UV LED light source, UV LED light source, UV LED curing machine, UV LED curing lamp, UV LED irradiator, UV LED point light source, UV LED line light source, UV LED surface light source, UV LED oven, UV LED curing furnace