An integrated circuit chip includes a silicon substrate, at least one circuit, a fixed sealing ring, a ground ring and at least one protective ring.

 

 

 

The circuit is formed on a silicon substrate and has at least one output/input pad. The fixed sealing ring is formed on the silicon substrate and surrounds the circuit and the output/input pad. The grounding ring is formed between the silicon substrate and the output/input pad, and is electrically connected with the fixed sealing ring. The protective ring is arranged on the silicon substrate and is electrically connected with the fixed sealing ring around the output/input pad.

 

 

 

The principle of UV glue and UV curing is used in the photosealing of integrated circuit wafer UVLED. Specifically manifested in: single component, easy to use, less waste, fast curing speed, generally a few seconds to tens of seconds can be completely cured, can be used in high-speed production lines, conducive to automated production, greatly improving production efficiency; room temperature or low temperature can be cured, can be used for non-heating curable materials; energy saving, UV solidification Compared with thermal curing resin, the energy consumed by chemical process can save 90% of energy consumption; the curing equipment is simple, occupies a small area and saves cost; low volatile monomers and oligomers are used, and solvents are not used, so there is basically no air pollution and wastewater pollution.

 

Futancy Production: UV LED Curing Machine, UV LED Point Light Source, UV LED Surface Light Source, UV LED Linear Light Source